MT3360BICG Philco navigation head unit BGA chip reballing stencil

$9.99

| Weight | 0.02 kg |
|---|---|
| Dimensions | 200 × 200 × 50 mm |
You must be logged in to post a review.
BGA Chip reballing brush soldering paste brush Applied to BGA Chip reballing process to spread the soldering paste or other soldering fluid, and clean the…
Electronic control unit circuit board soldering desoldering assist tools kit Dedicated Assist soldering and desoldering tools, 12 types.
Portable temperature adjustable desoldering hot air gun Power: 650 Watt; Temperature adjust range: 100 – 480 degree/ 212 F – 896 F Three Nozzle will…
MPC561 MPC562 Reballing stencil EDC7 EDC16 BGA MCU Chip reballing
Reviews
There are no reviews yet.