MPC561 MPC562 Reballing stencil EDC7 EDC16 BGA MCU Chip reballing

$9.99

| Weight | 0.008 kg |
|---|---|
| Dimensions | 100 × 100 × 100 mm |
You must be logged in to post a review.
Portable solder Iron temperature adjustable solder station Feature: 90-480 degree adjustable LED display Standard configuration: Solder iron 5 types solder horn
TMS320DRA342AZDK AUDI A5 0.5mm BGA chip reballing stencil 80*80mm, 0.5mm BGA reballing stencil for BGA Chip – TMS320DRA342AZDK.
Scald preventing desoldering wicks Multiple Size optional
Automatic desoldering pump desoldering gun Tin solder remove tools Standard configuration: 1PCS Desoldering gun 1PCS Base 1PCS 1.0mm Nozzle
Reviews
There are no reviews yet.