R8A77850B dedicated BGA Chip reballing stencil AUDI Audio host


$9.99


| Weight | 0.02 kg |
|---|---|
| Dimensions | 100 × 100 × 30 mm |
You must be logged in to post a review.
Portable solder Iron temperature adjustable solder station Feature: 90-480 degree adjustable LED display Standard configuration: Solder iron 5 types solder horn
MPC561 MPC562 Reballing stencil EDC7 EDC16 BGA MCU Chip reballing
TMS320DRA342AZDK AUDI A5 0.5mm BGA chip reballing stencil 80*80mm, 0.5mm BGA reballing stencil for BGA Chip – TMS320DRA342AZDK.
Mercedes Benz NTG5 W205 W217 W222 HU5 High headunit MCU ATMEL MEGA169P repair programming adapter This tools is applied to programming the Mercedes Benz S-class,…
Reviews
There are no reviews yet.