AUDI C7 A6 A7 A8 Lane adaptive cruise Camera module repair Xilinx BGA chip reballing stencil
Size: 0.2mm/52mm*60mm
$12.90
Size: 0.2mm/52mm*60mm
Weight | 0.05 kg |
---|---|
Dimensions | 10 × 10 × 10 mm |
You must be logged in to post a review.
AUDI C7 Typ 4G A6 A7 A8 AUDI fifth Gen Immobilization system programming test platform
AUDI active lane assist Adaptive cruise front camera image process test bench AUDI C7 Acc camera module (4G0907217) failure is a well known, usually cause…
AUDI Lane Departure System Lane Change Assist Front camera bench tester Used to test the AUDI C7 A6 A7 A8 S6 S7 S8 Front view…
GL512N11FFA02 AUDI BMW Head unit BGA Chip dedicated reballing stencil
Electronic control unit circuit board soldering desoldering assist tools kit Dedicated Assist soldering and desoldering tools, 12 types.
R8A77850B dedicated BGA Chip reballing stencil AUDI Audio host
MPC561 MPC562 Reballing stencil EDC7 EDC16 BGA MCU Chip reballing
Reviews
There are no reviews yet.