AUDI C7 A6 A7 A8 Lane adaptive cruise Camera module repair Xilinx BGA chip reballing stencil
Size: 0.2mm/52mm*60mm
$12.90
Size: 0.2mm/52mm*60mm
Weight | 0.05 kg |
---|---|
Dimensions | 10 × 10 × 10 mm |
You must be logged in to post a review.
AUDI Lane Departure System Lane Change Assist Front camera bench tester Used to test the AUDI C7 A6 A7 A8 S6 S7 S8 Front view…
AUDI C7 Typ 4G A6 A7 A8 AUDI fifth Gen Immobilization system programming test platform
AUDI active lane assist Adaptive cruise front camera image process test bench AUDI C7 Acc camera module (4G0907217) failure is a well known, usually cause…
GL512N11FFA02 AUDI BMW Head unit BGA Chip dedicated reballing stencil
Scald preventing desoldering wicks Multiple Size optional
Manual operation desoldering pump solder removal tool tin extractor Applied to desoldering the ECU Plug from the ECU Board, manual operation to suck the tin…
MT3360BICG Philco navigation head unit BGA chip reballing stencil
Reviews
There are no reviews yet.