$9.99
Weight | 0.02 kg |
---|---|
Dimensions | 200 × 200 × 50 mm |
Be the first to review “TCC8803 HYUNDAI head unit dedicated BGA Chip reballing Stencil” Cancel reply
You must be logged in to post a review.
Related products
-
$9.99
SAK-TC17xx Series BGA Chip reballing stencil
-
$169.00
Mercedes-Benz HU55 NTG5.5 High head unit 2GB Memory card initialize tools Used to initialize the Mercedes-Benz HU55 NTG5.5 high Head unit 2GB Memory card, also…
-
$29.90
Chip programming PIN holder legs gripper IC feet clip fixture Applied to clamp the IC chips legs or other components feet PIN, connect them to…
-
$85.00 – $89.90
Portable temperature adjustable desoldering hot air gun Power: 650 Watt; Temperature adjust range: 100 – 480 degree/ 212 F – 896 F Three Nozzle will…
Reviews
There are no reviews yet.