BGA Chip reballing brush soldering paste brush
Applied to BGA Chip reballing process to spread the soldering paste or other soldering fluid, and clean the BGA chips.
$1.00
Applied to BGA Chip reballing process to spread the soldering paste or other soldering fluid, and clean the BGA chips.
Weight | 0.05 kg |
---|---|
Dimensions | 150 × 120 × 80 mm |
You must be logged in to post a review.
Manual operation desoldering pump solder removal tool tin extractor Applied to desoldering the ECU Plug from the ECU Board, manual operation to suck the tin…
TMS320DRA342AZDK AUDI A5 0.5mm BGA chip reballing stencil 80*80mm, 0.5mm BGA reballing stencil for BGA Chip – TMS320DRA342AZDK.
High quality ECU tuning BDM Frame tuning probe set 4 PCS Probe set configuration: 4 PCS isolation metal heavy rod 4 PCS High quality copper…
Automatic desoldering pump desoldering gun Tin solder remove tools Standard configuration: 1PCS Desoldering gun 1PCS Base 1PCS 1.0mm Nozzle
Reviews
There are no reviews yet.