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Applied to BGA Chip reballing process to spread the soldering paste or other soldering fluid, and clean the BGA chips.
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AUDI head unit audio host headunit BGA chip NVIDIA 0.6mm reballing stencil
Scald preventing desoldering wicks Multiple Size optional
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TMS320DRA342AZDK AUDI A5 0.5mm BGA chip reballing stencil 80*80mm, 0.5mm BGA reballing stencil for BGA Chip – TMS320DRA342AZDK.
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